GSMicro Primary Agent Automotive Linear LED Constant Current Driver IC LAN1163E
- Model：
- LAN1163E
- Brand：
- GSMicro
- Batch No：
- LAN1163E, 100V linear constant current IC, automotive LED driver IC, wide voltage LED driver, ESOP8
- Desc：
- LAN1163E 100V high voltage linear constant current IC with 7V~100V wide input, max 1.2A output, programmable OTP & high voltage current foldback protection. ESOP8 package for automotive lights, motorcycle lamps, HX319A, QX7136, SM2082.
- Stock：
- 24000 只
LAN1163E 100V Linear Constant Current IC for LED Automotive Lighting – Wide Voltage Regulator – GSMicro Original Factory Supply
Keywords: LAN1163E,100V linear constant current IC,LED automotive driver chip,car light constant current IC,wide voltage regulator,ESOP8 package,GSMicro Semiconductor,original stock
I. Key Features
✔ High-Voltage, High-Current Linear Constant Current: Input voltage range 7V~100V, built-in 3A/100V power MOSFET, maximum continuous output current 1.2A.
✔ Ultra-Low Dropout Voltage: Only 0.5V dropout at 1.2A output, greatly reducing self-heating and power dissipation.
✔ Precision Adjustable Thermal Control: Default 135°C thermal regulation point; can be adjusted via ROTP pin with external resistor or NTC thermistor (placed near LEDs) for accurate LED temperature control, no flickering at high temperatures.
✔ High-Voltage Current Foldback: Enable by grounding SEL pin; when VIN ≥15V, output current decreases as voltage rises, protecting the IC from automotive/EV power surges.
✔ Extremely Simple External Circuitry: Only two external resistors (Rcs for current setting + ROTP/NTC for thermal control) needed to form a complete constant current circuit. Supports capacitor-less operation and multi-chip parallel current sharing.
✔ Excellent Thermal Package: ESOP8 package with large exposed DR pad for heat sinking; thermal resistance (Rthjd) as low as 10°C/W; must be tightly attached to an aluminum or copper PCB.
II. Electrical Characteristics
| Parameter | Symbol | Test Condition | Typical Value | Unit |
|---|---|---|---|---|
| Operating Voltage Range | OP_VDD | - | 7 - 100 | V |
| Current Sense Reference Voltage | VREF_CS | Io=500mA | 300 | mV |
| Output Current Accuracy | △Io | Io=500mA | 4 | % |
| Power MOSFET On-Resistance | Rds_ON | Io=1A | 200 | mΩ |
| Maximum Output Current | Iout | - | 1.2 | A |
| Thermal Regulation Set Point | Treg | ROTP=∞ | 135 | ℃ |
| ROTP=82KΩ | 120 | ℃ | ||
| ROTP=75KΩ | 110 | ℃ | ||
| IC Quiescent Current | I_VDD | VIN=12V | 180 | uA |
III. Internal Block Diagram / Typical Application Circuit
IV. Pin Description
| Pin/Area | Symbol | Description |
|---|---|---|
| 1 | VIN | LAN1163E power supply input (7V-100V) |
| 2 | GND | LAN1163E ground, connect to input ground |
| 3 | CS | LAN1163E current sense pin, connect Rcs to GND to set output current |
| 4 | S | LAN1163E source of power MOSFET |
| 5 | DR | LAN1163E LED constant current output, connect to LED cathode |
| 6 | ROTP | LAN1163E temperature adjustment pin, connect resistor or NTC (float = 135°C default) |
| 7 | SGND | LAN1163E internal signal ground (connected to GND internally, no external connection needed) |
| 8 | SEL | LAN1163E high-voltage protection selection, connect to SGND to enable current foldback, float to disable |
| Exposed Pad | DR | LAN1163E LED driver output, connected to pin 5, must be soldered to PCB for heat dissipation |
V. Package Outline Drawing
VI. Package Dimensions (ESOP8)
VII. Maximum Application Power Ratings
| Symbol | Millimeters (mm) | Inches (inch) | ||
|---|---|---|---|---|
| Min | Max | Min | Max | |
| A | 1.350 | 1.750 | 0.053 | 0.069 |
| A1 | 0.050 | 0.250 | 0.002 | 0.010 |
| A2 | 1.250 | 1.650 | 0.049 | 0.065 |
| b | 0.310 | 0.510 | 0.012 | 0.020 |
| D | 4.700 | 5.150 | 0.185 | 0.203 |
| E | 3.800 | 4.000 | 0.150 | 0.157 |
| E1 | 5.800 | 6.200 | 0.228 | 0.244 |
| e | 1.270 (BSC) | 0.050 (BSC) | ||
| L | 0.400 | 1.270 | 0.016 | 0.050 |
| Input Voltage | Output Voltage | Maximum Output Current |
|---|---|---|
| 12–14V | 12V | 1.2A |
| 24V | 12V | 0.8A |
| 36V | 12V | 0.5A |
| 48V–100V | 12V | 0.3A |
| 12–24V | 18V | Not recommended due to low dropout |
VIII. Application Notes
1. Constant Current Setting: Output current Io = 0.3V ÷ Rcs. For 1A output, use Rcs = 0.3Ω (300mΩ), power rating ≥0.3W.
2. Over-Temperature Protection Setting: Float ROTP → chip junction temperature reduces current at 135°C; external 82kΩ resistor reduces to 120°C, 75kΩ to 110°C. Placing an NTC thermistor near the LEDs enables precise LED temperature control.
3. High-Voltage Current Foldback: Connect SEL to SGND to enable. When input VIN ≥15V, output current decreases as voltage rises, suitable for 12V/24V automotive and EV power environments, preventing overvoltage overheating damage.
4. Reverse Polarity Protection: Add an A7 diode or 1kΩ resistor in series with the VIN port to prevent damage from reverse connection; a high-current Schottky diode can be added in the main loop.
5. Multi-Chip Parallel Operation: Tie VIN together and DR together, but CS pins must each have their own separate Rcs resistor. This can extend output current (e.g., two chips in parallel deliver 2.4A).
6. PCB Thermal Design: The exposed ESOP8 bottom DR pad must be tightly attached to an aluminum or copper PCB; use 2W thermal conductive insulation layer in the IC area; widen high-current traces (S, input, output) as much as possible.
IX. Applications
Automotive headlights, electric vehicle/motorcycle lights, bicycle lights, high-power flashlights, LED desk lamps, LED miner lamps, rechargeable floodlights, low-voltage LED strips, DC LED lighting drivers, smart PWM dimming power supplies.
X. Compatibility Replacement and Market Comparison
The LAN1163E is a compatible evaluation or replacement for linear constant current drivers such as HX319A, QX7136 (low voltage), SM2082 series (except high-voltage AC types), etc. Compared to similar competing products, the key advantages of the LAN1163E are:
➤ More Flexible Thermal Control: Not only has a built-in 135°C default OTP, but also a dedicated ROTP pin, supporting resistor-preset over-temperature points or external NTC to directly monitor LED temperature, avoiding LED lumen depreciation and dead lamps. Competitors often have fixed OTP or no external adjustment.
➤ Automotive-Grade High-Voltage Protection: Unique SEL pin controlled "high-voltage current foldback" linearly reduces current when VIN ≥15V, specially adapted to 12V/24V vehicle power fluctuations, improving system reliability.
➤ Lower Dropout & Lower Power Consumption: Only 0.5V dropout at 1.2A, Rds_on as low as 200mΩ, less self-heating, allowing higher current or higher ambient temperature on the same aluminum PCB.
➤ Easy Paralleling & Capacitor-less Operation: Explicitly supports multi-chip parallel (separate CS resistors) and capacitor-less applications, ideal for multi-channel aluminum PCB miner lamps, floodlights, and cost-sensitive designs.
XI. GSMicro Linear Automotive Headlight Driver IC Parameter Comparison
| Model | Package | Voltage Rating | OTP Point | Matching LED Voltage | Maximum Application Current |
|---|---|---|---|---|---|
| LAN1032AT | SOT89-5L | 48V | 140℃ | 9V | 0.6A@Vin=13V Vout=9V |
| LAN1032E | ESOP8 | 48V | 140℃ | 9V | 0.8A@Vin=13V Vout=9V |
| LAN1161ED | ESOP8 | 100V | 120℃ | 12V | 1.2A@Vin=13.5V Vout=12V |
| LAN1163E | ESOP8 | 100V | 135℃ | 12V | 1.2A@Vin=13.5V Vout=12V |
| LAN1165ED | ESOP8 | 100V | 120℃ | 12V | 2A@Vin=13.5V Vout=12V |
| LAN1165E | ESOP8 | 100V | 135℃ | 12V | 2A@Vin=13.5V Vout=12V |
| LAN1166ED | ESOP8 | 100V | 120℃ | 12V | 4A@Vin=13.5V Vout=12V |
| LAN1166E | ESOP8 | 100V | 135℃ | 12V | 4A@Vin=13.5V Vout=12V |
| LAN1168ED | ESOP8 | 200V | 120℃ | 24V | 1.2A@Vin=27V Vout=24V |
| LAN1053A | ESOP8 | 100V | 135℃ | 9V | 1.2A@Vin=13.5V Vout=9V |
| LAN1058A | ESOP8 | 200V | 135℃ | 24V | 1.2A@Vin=27V Vout=24V |
XII. Comparison with Mainstream Competitors (SL7108/OC7201C)
| Comparison Item | LAN1163E (GSMicro) | SL7108 (Competitor) | OC7201C (Competitor) |
|---|---|---|---|
| Input Voltage Range | 7V–100V Ultra-Wide | 2.5V–40V | 4.5V–40V |
| Voltage Rating | 100V | 40V | 40V |
| Over-Temperature Protection | 135°C Programmable, Wider Applicability | 125°C Fixed | 125°C Fixed |
| Programmable Thermal Pin | ✅ Yes, with ROTP for external resistor/NTC | ❌ No | ❌ No |
| High-Voltage Current Foldback | ✅ Yes, automatic current reduction from 15V, no light-off | ❌ No, over-voltage easy to burn | ❌ No, over-voltage easy to burn |
| Dropout Voltage | 0.5V@1.2A, Lower Heat | 1.2V@1A | 0.8V@2.4A |
| Package | ESOP8 High-Thermal, Suitable for High Power | ESOP8 Standard | DFN High-Cost |
| Automotive/EV Suitability | 12V/24V/48V/72V Universal | Only Suitable for Low-Voltage Stable Scenarios | High-Current Scenarios, Higher Cost |
LAN1163E Core Advantages: Compared to SL7108 and OC7201C, it features 100V ultra-high voltage rating, 7V–100V ultra-wide input, 135°C programmable over-temperature protection, unique high-voltage current foldback without light-off, extremely low dropout and low heat generation, making it ideal for complex fluctuating voltages in automotive/EV applications. It supports multi-chip parallel current sharing, simple external circuitry, and higher cost-effectiveness for high-power scenarios.
XIII. Replaceable Products and Advantages
LAN1163E can directly replace HX319A, QX7136, SM2082 series, conventional high-voltage linear constant current ICs, and high-power LED automotive driver ICs.
LAN1163E supports 7V–100V ultra-wide high voltage, 1.2A continuous output – higher voltage rating and current margin
LAN1163E integrates programmable over-temperature + high-voltage current foldback – safer in complex automotive/EV power environments, no dead LEDs
LAN1163E requires only two external resistors, supports capacitor-less design – low BOM cost, extremely easy mass production
LAN1163E features 0.5V ultra-low dropout at 1.2A – low conduction loss, lower heat, higher power capability under same thermal conditions
LAN1163E supports multi-chip independent parallel current sharing in ESOP8 high-thermal package – ideal for high-power headlights, miner lamps, floodlights
XIV. Recommended Related Models
GSMicro's full series of automotive linear constant current ICs: LAN1032AT, LAN1032E, LAN1163E, LAN1161ED, LAN1165ED, LAN1165E, LAN1166ED, LAN1166E, LAN1168ED, LAN1053A, LAN1058A, covering 48V/100V/200V voltage ratings, meeting all power levels and applications for car headlights, taillights, EV lights, and truck lights.
Frequently Asked Questions (FAQ)
1. How to calculate and set the output current of the LAN1163E? Does it support higher current?
Output current Iout = 0.3V / RCS, where RCS is the resistor from CS pin to ground. For example, for 1A current, use RCS = 0.3Ω; for 600mA, use RCS = 0.5Ω. It is recommended to use 1206 or larger package resistors to withstand power loss. For higher current, multiple LAN1163E chips can be paralleled: tie VIN and DR together, but each CS pin must have its own independent Rcs resistor. In theory, N chips in parallel can deliver N × 1.2A.
2. How does the programmable over-temperature protection (ROTP) of LAN1163E work? Why is it better than fixed OTP?
When the ROTP pin is left floating, the chip starts linearly reducing current when the junction temperature reaches 135°C. External resistors can lower the thermal regulation point: 82kΩ → 120°C, 75kΩ → 110°C. A more advanced application is to connect an NTC thermistor (e.g., 100kΩ B=3950) in series with a fixed resistor to ROTP, and place the NTC close to the LED beads to achieve "direct LED temperature control", avoiding lumen depreciation and dead LEDs. Compared to competitors' fixed 125°C protection, the ROTP scheme allows flexible configuration based on actual heat dissipation and LED temperature tolerance, significantly improving reliability.
3. What is the purpose of the SEL pin high-voltage current foldback? In what scenarios must it be enabled?
Connecting SEL to SGND enables the foldback function: when the input voltage VIN ≥ 15V, the chip automatically reduces output current – the higher the voltage, the more the current decreases. This prevents damage to the LED or chip when the 12V system experiences generator anomalies or accidental connection to 24V. In applications with voltage fluctuations such as cars, EVs, and motorcycles, it is strongly recommended to enable this function (SEL to SGND). If the operating voltage is stably ≤15V (e.g., regulated power supply), SEL can be left floating to obtain full current output.
4. Why can the LAN1163E achieve an ultra-low dropout of 0.5V? How does this help with heat dissipation?
The chip integrates a low on-resistance power MOSFET (Rds_on typical 200mΩ). At 1.2A, the MOSFET drop is only 0.24V; adding the 0.3V sense resistor voltage and trace losses gives a total dropout of about 0.5V. Low dropout means low chip self-heating (P = dropout × current). For example, at 12V input, 12V LED, and 1.2A, the chip dissipation is only about 0.6W – far lower than the 2W+ of ordinary linear ICs. This reduces thermal stress on the aluminum PCB, allowing higher ambient temperatures or more compact lamp designs.
5. Does the LAN1163E support PWM dimming? Is capacitor-less operation reliable?
Yes. Low-frequency dimming can be achieved by toggling the VIN pin, or high-frequency PWM dimming (recommended ≤1kHz) by adding an NMOS in series with the LED loop. Capacitor-less design means the chip can operate stably without electrolytic capacitors on input or output, suitable for cost-sensitive or space-constrained light boards. However, to improve EMI and surge immunity, it is still recommended to parallel a 10μF~100μF capacitor across VIN and GND.
6. Can the LAN1163E directly replace HX319A or QX7136? What should be noted?
Yes, all three are ESOP8 packaged 100V-class linear constant current ICs, but the LAN1163E adds ROTP and SEL pins, so the PCB must have corresponding resistor pads. If the original board does not have ROTP/SEL networks, leave ROTP floating and connect SEL to GND for basic compatibility. After replacement, it is recommended to re-confirm the current setting resistor Rcs, because the reference voltage is also 300mV, so the calculation formula is the same.
7. What are the key PCB thermal design points for the LAN1163E?
① The large exposed DR pad on the bottom of ESOP8 must be reliably soldered and tightly attached to an aluminum or copper PCB. It is recommended to use thermal grease or thermal pad with thermal conductivity ≥2W/m·K;
② Increase the copper area around the chip as much as possible, especially for the DR pin and VIN traces;
③ For high-current applications, add thermal vias near the chip to conduct heat to the backside for auxiliary heat dissipation;
④ Avoid placing high heat-generating components (such as resistors, other ICs) close to the LAN1163E.
8. How to apply for LAN1163E samples or get technical support?
GSMicro provides free samples (up to 5 pieces per order) and technical reference designs. Please contact the sales hotline 18018703531 (Mr. He Long), or add WeChat gsmicro_semi (note: LAN1163E sample), or send an email to sales@gs-micro.com. Batch orders: 4000 pieces/reel, direct shipment from Shenzhen original stock, lead time 3-5 working days.
XV. Ordering Information
| Model | Package | Marking | Packing Form |
|---|---|---|---|
| LAN1163E | ESOP8 | LAN1163E HAYYWW | Tape & Reel, 4000pcs/reel, Shenzhen original stock direct shipping |
Source: GSMicro Semiconductor (Shenzhen) Co., Ltd. LAN1163E_Datasheet_EN_Rev1.3. Parameters subject to the latest official datasheet.
XVI. Company Profile
GSMicro Semiconductor (Shenzhen) Co., Ltd. (hereinafter referred to as "GSMicro") was established in 2023. Its predecessor, LUMENCHIP, was founded in 2010 and headquartered in Shenzhen, the technology capital of China. GSMicro is a leading analog IC integrated service provider dedicated to the technical implementation and product commercialization of mixed-signal chips, promoting the development of green intelligent technology.
GSMicro integrates outstanding domestic and international models and channels, breaking the traditional independent distribution and agency model. It has established a dual model with stronger vitality that combines hybrid agency distribution, market analysis and forecasting, technical solution services, and one-stop supply. Its agency lines coexist with its own brands, and distribution lines coexist with supporting supply – all three complement each other with a unique style. Our only goal is to serve you wholeheartedly, meet customer needs, provide innovative and customer-oriented products and services to global customers, help customers achieve sustained profitability and success, and build the future of the customer market.
GSMicro has the industry's most complete solutions and product lines including MCUs, power management ICs, signal chain ICs, and power devices. The product range is comprehensive, covering signal processing, power management, automotive electronics, LED lighting, and more. With strong marketing planning capabilities and rich professional market operation experience, its authorized partners include DONGWOON (Korea), China Resources Micro (PowTech, CR MICRO), CRHJ, APM, COOLSEMI, ANHI, Reasunos, OCX, MassChip, XLSEMI, Zhixin Semiconductor, NSIWAY, EGmicro, Ruimeng Technology, ChipWays, AISPEECH, Aerosemi, and others.
GSMicro adheres to the corporate values of "Striver-oriented, customer-centered, and value-contribution focused," specializing in the technology and product implementation of agent chips, promoting the sustainable development of green intelligent technology. Its agent distribution and application solutions lead the global semiconductor market segments.
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